Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint
Published 2023 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 34, Issue 4, Pages -
Publisher
Springer Science and Business Media LLC
Online
2023-01-25
DOI
10.1007/s10854-022-09465-2
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
- (2022) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
- (2022) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
- (2022) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
- (2021) Sri Harini Rajendran et al. JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
- Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration
- (2016) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging
- (2016) Lizhuang Yang et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping
- (2015) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE
- In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
- (2014) A.S.M.A. Haseeb et al. INTERMETALLICS
- A review: On the development of low melting temperature Pb-free solders
- (2014) Hiren R. Kotadia et al. MICROELECTRONICS RELIABILITY
- Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
- (2012) S.L. Tay et al. INTERMETALLICS
- Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
- (2011) S.Y. Chang et al. MATERIALS & DESIGN
- Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds
- (2011) A.S.M.A. Haseeb et al. MATERIALS CHARACTERIZATION
- Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
- (2011) S.L. Tay et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples
- (2010) Yu-chih Huang et al. JOURNAL OF ELECTRONIC MATERIALS
- Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
- (2008) Zhiheng Huang et al. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
- Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate
- (2007) Pei Yao et al. JOURNAL OF ALLOYS AND COMPOUNDS
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started