Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces

(2020) Samuel J. Griffiths et al.   ACS Applied Materials & Interfaces

Growth kinetics, microhardness and microstructure evolution of undercooled FeCoNiCuSn high entropy alloy

(2020) M.R. Rahul et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructural origins of the high mechanical damage tolerance of NbTaMoW refractory high-entropy alloy thin films

(2019) Matheus A. Tunes et al.   MATERIALS & DESIGN

Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys

(2019) Yee-Wen Yen et al.   JOM

Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

(2019) Fan-Yi Ouyang et al.   MICROELECTRONICS RELIABILITY

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

(2019) Yu-An Shen et al.   Scientific Reports

Lattice distortion effect on elastic anisotropy of high entropy alloys

(2019) Chao-Chun Yen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

(2019) Zhi Jin et al.   JOURNAL OF APPLIED PHYSICS

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

(2019) Siliang He et al.   JOURNAL OF MATERIALS SCIENCE

Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder

(2019) József Hlinka et al.   APPLIED SURFACE SCIENCE

FeMnNiCoCr-based high entropy alloy coatings: Effect of nitrogen additions on microstructural development, mechanical properties and tribological performance

(2019) Chuhan Sha et al.   APPLIED SURFACE SCIENCE

Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints

(2019) Jungsoo Kim et al.   APPLIED SURFACE SCIENCE

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

(2019) Yu-An Shen et al.   MATERIALS & DESIGN

High temperature wear performance of laser-cladded FeNiCoAlCu high-entropy alloy coating

(2018) Guo Jin et al.   APPLIED SURFACE SCIENCE

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

(2018) Asisa Kumar Panigrahy et al.   JOURNAL OF ELECTRONIC PACKAGING

Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

(2018) Hyunju Lee et al.   MICROELECTRONICS RELIABILITY

Design of non-equiatomic medium-entropy alloys

(2018) Yang Zhou et al.   Scientific Reports

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

(2018) Yu-An Shen et al.   MATERIALS LETTERS

A review of lead-free solders for electronics applications

(2017) Shunfeng Cheng et al.   MICROELECTRONICS RELIABILITY

Intermetallic compounds in 3D integrated circuits technology: a brief review

(2017) Syahira Annuar et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

(2016) Yuan-Wei Chang et al.   ACTA MATERIALIA

Dissolution and precipitation kinetics of Cu 6 Sn 5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

(2016) N. Zhao et al.   INTERMETALLICS

Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates

(2016) Qianye Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

(2016) Woo-Ram Myung et al.   JOURNAL OF ELECTRONIC MATERIALS

Characterization of the microstructure of the compositionally complex alloy Al 1 Mo 0.5 Nb 1 Ta 0.5 Ti 1 Zr 1

(2016) J.K. Jensen et al.   SCRIPTA MATERIALIA

Processing, Microstructure and Mechanical Properties of the CrMnFeCoNi High-Entropy Alloy

(2015) Bernd Gludovatz et al.   JOM

High entropy alloy thin films deposited by magnetron sputtering of powder targets

(2015) B.R. Braeckman et al.   THIN SOLID FILMS

Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient

(2014) Wei-Neng Hsu et al.   ACTA MATERIALIA

Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

(2014) Shou-Jen Hsu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microstructure and corrosion behaviour of FeCoNiCuSnxhigh entropy alloys

(2014) Z. Y. Zheng et al.   MATERIALS SCIENCE AND TECHNOLOGY

Recrystallization Behavior of CoCrCuFeNi High-Entropy Alloy

(2014) Nokeun Park et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

(2014) T.C. Huang et al.   SCRIPTA MATERIALIA

High-Entropy Alloys: A Critical Review

(2014) Ming-Hung Tsai et al.   Materials Research Letters

Sluggish diffusion in Co–Cr–Fe–Mn–Ni high-entropy alloys

(2013) K.-Y. Tsai et al.   ACTA MATERIALIA

Fluxless tin bonding of silicon chips to iron substrates

(2013) Shou-Jen Hsu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

(2013) Y. Tang et al.   MATERIALS & DESIGN

Microstructure and the properties of FeCoCuNiSnx high entropy alloys

(2012) L. Liu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

(2012) H.-Y. Hsiao et al.   SCIENCE

Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates

(2012) Vignesh U. Nayak et al.   TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

(2011) Kiju Lee et al.   JOURNAL OF MATERIALS RESEARCH

Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance

(2011) Xiao Cao et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

(2010) Chih Chen et al.   Annual Review of Materials Research

Effect of aging treatment on microstructure and properties of high-entropy Cu0.5CoCrFeNi alloy

(2010) Chun-Ming Lin et al.   INTERMETALLICS

Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications

(2010) Rongwei Zhang et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

(2010) Young Min Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process

(2010) K.H. Kim et al.   SCRIPTA MATERIALIA

The root causes of the “Black pad” phenomenon and avoidance tactics

(2008) Katsuaki Suganuma et al.   JOM