Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates

Published 2016 View Full Article

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Title
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Authors
Keywords
Nanosilver paste, ENIG, Electroplated Ni/Au, Interfacial reaction, Microstructures
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 675, Issue -, Pages 317-324
Publisher
Elsevier BV
Online
2016-03-19
DOI
10.1016/j.jallcom.2016.03.133

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