Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

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Title
Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration
Authors
Keywords
Grain orientation, Anisotropic diffusion, Intermetallic compounds, Electromigration
Journal
SCRIPTA MATERIALIA
Volume 128, Issue -, Pages 6-9
Publisher
Elsevier BV
Online
2016-09-26
DOI
10.1016/j.scriptamat.2016.09.028

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