Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Published 2010 View Full Article

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Title
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 12, Pages 2504-2512
Publisher
Springer Nature
Online
2010-09-23
DOI
10.1007/s11664-010-1379-x

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