Fluxless tin bonding of silicon chips to iron substrates

Published 2013 View Full Article

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Title
Fluxless tin bonding of silicon chips to iron substrates
Authors
Keywords
Solder Joint, Reflow Time, Thin Solder, Fluxless Bonding Process
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 24, Issue 8, Pages 2890-2896
Publisher
Springer Nature
Online
2013-03-18
DOI
10.1007/s10854-013-1187-1
References
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