Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

An observation and explanation of interior cracking at the interface of solder by electromigration

(2019) Qizhi Wang et al.   MICROELECTRONICS RELIABILITY

Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

(2018) K.N. Tu et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current

(2017) Q. S. Zhu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

(2017) Fengjiang Wang et al.   MICROELECTRONICS RELIABILITY

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

(2016) Yuan-Wei Chang et al.   ACTA MATERIALIA

Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA Packages

(2015) M. L. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

(2010) Chih Chen et al.   Annual Review of Materials Research

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

(2010) L.D. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

(2010) Y.C. Chan et al.   PROGRESS IN MATERIALS SCIENCE

The difference in the types of intermetallic compound formed between the cathode and anode of an Sn–Ag–Cu solder joint under current stressing

(2009) Tsung-Chieh Chiu et al.   INTERMETALLICS

Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions

(2008) Chih-chi Chen et al.   JOURNAL OF APPLIED PHYSICS

Pronounced electromigration of Cu in molten Sn-based solders

(2008) J.R. Huang et al.   JOURNAL OF MATERIALS RESEARCH