Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

Published 2014 View Full Article

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Title
Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder
Authors
Keywords
Bonding Process, Bonding Pressure, Fracture Force, Joint Thickness, Bonding Design
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 25, Issue 8, Pages 3276-3284
Publisher
Springer Nature
Online
2014-05-19
DOI
10.1007/s10854-014-2014-z
References
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