Dissolution and precipitation kinetics of Cu 6 Sn 5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

Published 2016 View Full Article

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Title
Dissolution and precipitation kinetics of Cu 6 Sn 5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient
Authors
Keywords
Intermetallics, 3D packaging, Synchrotron radiation, Thermomigration, Micro interconnect, Interfacial reaction
Journal
INTERMETALLICS
Volume 79, Issue -, Pages 28-34
Publisher
Elsevier BV
Online
2016-09-23
DOI
10.1016/j.intermet.2016.08.008

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