Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

Title
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 55, Issue -, Pages 574-582
Publisher
Elsevier BV
Online
2013-10-24
DOI
10.1016/j.matdes.2013.10.033

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