Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Title
Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints
Authors
Keywords
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Journal
JOURNAL OF MATERIALS RESEARCH
Volume 26, Issue 03, Pages 467-474
Publisher
Cambridge University Press (CUP)
Online
2011-02-11
DOI
10.1557/jmr.2010.86

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