Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

Published 2019 View Full Article

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Title
Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure
Authors
Keywords
Pb-free solders, Intermetallic compound, Metals and alloys, Diffusion, Temperature gradient
Journal
MICROELECTRONICS RELIABILITY
Volume 97, Issue -, Pages 16-23
Publisher
Elsevier BV
Online
2019-04-23
DOI
10.1016/j.microrel.2019.03.005

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