Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

Published 2014 View Full Article

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Title
Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 80, Issue -, Pages 37-40
Publisher
Elsevier BV
Online
2014-02-20
DOI
10.1016/j.scriptamat.2014.02.010

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