Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Published 2018 View Full Article

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Title
Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps
Authors
Keywords
Diffusion, Grain boundary, Grain orientation, Intermetallic compounds, Thermomigration
Journal
MATERIALS LETTERS
Volume 236, Issue -, Pages 190-193
Publisher
Elsevier BV
Online
2018-10-20
DOI
10.1016/j.matlet.2018.10.112

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