Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

(2014) Woo-Ram Myung et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Ti addition to Sn–Ag and Sn–Cu solders

(2012) W.M. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

(2012) Christopher Fuchs et al.   JOURNAL OF MATERIALS SCIENCE

Reliability of Pb-free solders for harsh environment electronic assemblies

(2011) S Godard Desmarest   MATERIALS SCIENCE AND TECHNOLOGY

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

(2011) Sang-Su Ha et al.   MATERIALS TRANSACTIONS

In situ observations on shear and creep–fatigue fracture behaviors of SnBi/Cu solder joints

(2010) Q.K. Zhang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

(2009) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect

(2008) C. Z. Liu et al.   JOURNAL OF MATERIALS SCIENCE