Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Published 2010 View Full Article
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Title
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Authors
Keywords
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Journal
Annual Review of Materials Research
Volume 40, Issue 1, Pages 531-555
Publisher
Annual Reviews
Online
2010-07-03
DOI
10.1146/annurev.matsci.38.060407.130253
References
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Related references
Note: Only part of the references are listed.- Thermomigration in Pb-free SnAg solder joint under alternating current stressing
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- Electromigration Test on Void Formation and Failure Mechanism of FCBGA Lead-Free Solder Joints
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