Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates

Published 2012 View Full Article

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Title
Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates
Authors
Keywords
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Journal
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS
Volume 65, Issue 6, Pages 713-717
Publisher
Springer Nature
Online
2012-10-08
DOI
10.1007/s12666-012-0193-y
References
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