Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Properties of atomized AlCoCrFeNi high-entropy alloy powders and their phase-adjustable coatings prepared via plasma spray process

(2019) Kuei-Chung Cheng et al.   APPLIED SURFACE SCIENCE

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

(2018) Yu-An Shen et al.   MATERIALS LETTERS

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

High-entropy alloy: challenges and prospects

(2016) Y.F. Ye et al.   Materials Today

Metastable high-entropy dual-phase alloys overcome the strength–ductility trade-off

(2016) Zhiming Li et al.   NATURE

Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints

(2014) Amaneh Tasooji et al.   JOURNAL OF ELECTRONIC MATERIALS

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

(2011) Dhafer Abdulameer Shnawah et al.   MICROELECTRONICS RELIABILITY

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Equilibrium phase of high-entropy FeCoNiCrCu0.5 alloy at elevated temperature

(2009) Chun-Ming Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES