Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

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Dislocation nucleation governed softening and maximum strength in nano-twinned metals

(2010) Xiaoyan Li et al.   NATURE

A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction

(2009) H. F. Zou et al.   JOURNAL OF APPLIED PHYSICS

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

(2009) K. Lu et al.   SCIENCE

Revealing the Maximum Strength in Nanotwinned Copper

(2009) L. Lu et al.   SCIENCE

Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

(2008) H.F. Zou et al.   ACTA MATERIALIA

Epitaxial nanotwinned Cu films with high strength and high conductivity

(2008) O. Anderoglu et al.   APPLIED PHYSICS LETTERS

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

(2008) Minhua Lu et al.   APPLIED PHYSICS LETTERS

Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

(2008) Luhua Xu et al.   JOURNAL OF APPLIED PHYSICS

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

(2008) K.-C. Chen et al.   SCIENCE