Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics
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Title
Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics
Authors
Keywords
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Journal
Scientific Reports
Volume 10, Issue 1, Pages -
Publisher
Springer Science and Business Media LLC
Online
2020-09-10
DOI
10.1038/s41598-020-71926-7
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