Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation

Published 2017 View Full Article

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Title
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 76-77, Issue -, Pages 601-605
Publisher
Elsevier BV
Online
2017-07-16
DOI
10.1016/j.microrel.2017.07.052

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