The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

Mechanical and electrical properties of reverse-offset printed Sn-Ag-Cu solder bumps

(2018) Min-Jung Son et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x = 0, 1, 2.5, 5 wt%) solders

(2018) Reza Sayyadi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

(2017) F. Khodabakhshi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

(2017) Phairote Sungkhaphaitoon et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

A review of lead-free solders for electronics applications

(2017) Shunfeng Cheng et al.   MICROELECTRONICS RELIABILITY

On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface

(2016) O.Y. Liashenko et al.   ACTA MATERIALIA

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration

(2016) M. Nasir Bashir et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints

(2016) Q.B. Tao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

(2015) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn–6.5Zn–xCu Pb-free solders

(2015) A.A. El-Daly et al.   MATERIALS & DESIGN

Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products

(2015) A.A. El-Daly et al.   MATERIALS & DESIGN

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

(2015) Lei Sun et al.   Advances in Materials Science and Engineering

Kinetics of the polymorphic phase transformation of Cu6Sn5

(2014) Guang Zeng et al.   ACTA MATERIALIA

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

(2013) A.E. Hammad   MATERIALS & DESIGN

Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders

(2013) A. Kantarcıoğlu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering

(2012) Ming Yang et al.   INTERMETALLICS

The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads

(2012) Asit Kumar Gain et al.   INTERMETALLICS

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

(2012) S.L. Tay et al.   INTERMETALLICS

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

(2012) Dhafer Abdulameer Shnawah et al.   JOURNAL OF ELECTRONIC MATERIALS

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

(2012) A.A. El-Daly et al.   MATERIALS & DESIGN

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

(2012) Dhafer Abdul-Ameer Shnawah et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

(2012) X.D. Liu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Creep Behavior of Bi-Containing Lead-Free Solder Alloys

(2011) David Witkin   JOURNAL OF ELECTRONIC MATERIALS

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

(2011) Tong An et al.   JOURNAL OF ELECTRONIC PACKAGING

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

(2011) T.Y. Kang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Development of SnAg-based lead free solders in electronics packaging

(2011) Liang Zhang et al.   MICROELECTRONICS RELIABILITY

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

(2011) Dhafer Abdulameer Shnawah et al.   MICROELECTRONICS RELIABILITY

Solid state interfacial reactions in electrodeposited Cu/Sn couples

(2010) Wen-ming TANG et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

(2009) Kannachai Kanlayasiri et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I

(2008) Zbigniew Moser et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

(2008) T. Laurila et al.   MICROELECTRONICS RELIABILITY

Research advances in nano-composite solders

(2008) J. Shen et al.   MICROELECTRONICS RELIABILITY