Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material

Published 2013 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material
Authors
Keywords
-
Journal
APPLIED THERMAL ENGINEERING
Volume 64, Issue 1-2, Pages 51-63
Publisher
Elsevier BV
Online
2013-12-12
DOI
10.1016/j.applthermaleng.2013.12.006

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.