Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
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Title
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
Authors
Keywords
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Journal
Scientific Reports
Volume 7, Issue 1, Pages -
Publisher
Springer Nature
Online
2017-12-15
DOI
10.1038/s41598-017-06250-8
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Note: Only part of the references are listed.- Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
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