Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure

Published 2020 View Full Article

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Title
Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure
Authors
Keywords
Mechanics-based acceleration, Thermal cycling, Fatigue life estimation, Unified creep-plastic model, Electronic packaging structure
Journal
MICROELECTRONICS RELIABILITY
Volume 107, Issue -, Pages 113616
Publisher
Elsevier BV
Online
2020-02-27
DOI
10.1016/j.microrel.2020.113616

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