Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system
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Title
Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume -, Issue -, Pages -
Publisher
Springer Nature
Online
2018-07-16
DOI
10.1007/s10854-018-9667-y
References
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Related references
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- (2008) L. Feller et al. MICROELECTRONICS RELIABILITY
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