Coupling damage and reliability modeling for creep and fatigue of solder joint

Published 2017 View Full Article

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Title
Coupling damage and reliability modeling for creep and fatigue of solder joint
Authors
Keywords
Low-cycle fatigue, Creep, Reliability, Strain rate, Damage
Journal
MICROELECTRONICS RELIABILITY
Volume 75, Issue -, Pages 233-238
Publisher
Elsevier BV
Online
2017-03-31
DOI
10.1016/j.microrel.2017.03.016

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