Approach of a physically based lifetime model for solder layers in power modules

Title
Approach of a physically based lifetime model for solder layers in power modules
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 53, Issue 9-11, Pages 1199-1202
Publisher
Elsevier BV
Online
2013-10-13
DOI
10.1016/j.microrel.2013.07.094

Ask authors/readers for more resources

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started