Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste

Published 2020 View Full Article

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Title
Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste
Authors
Keywords
Solder paste, Sn-Ag-Cu (SAC), Nanoparticles, Nanocomposite, DSC
Journal
THERMOCHIMICA ACTA
Volume 690, Issue -, Pages 178642
Publisher
Elsevier BV
Online
2020-06-06
DOI
10.1016/j.tca.2020.178642

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