Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints

Published 2019 View Full Article

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Title
Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints
Authors
Keywords
Lead-free soldering, PCB cracking, Anisotropy of tin grains, Passive components, Finite element modelling
Journal
MICROELECTRONICS RELIABILITY
Volume 93, Issue -, Pages 61-71
Publisher
Elsevier BV
Online
2019-01-11
DOI
10.1016/j.microrel.2019.01.006

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