Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Title
Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON POWER ELECTRONICS
Volume 35, Issue 9, Pages 8956-8964
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2020-02-12
DOI
10.1109/tpel.2020.2973312

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