Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations

Published 2018 View Full Article

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Title
Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2018-09-30
DOI
10.1016/j.microrel.2018.07.082

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