A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates

Title
A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates
Authors
Keywords
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Journal
JOURNAL OF MECHANICS
Volume 33, Issue 01, Pages 35-40
Publisher
Cambridge University Press (CUP)
Online
2016-05-12
DOI
10.1017/jmech.2016.30

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