Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

Published 2020 View Full Article

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Title
Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects
Authors
Keywords
Phase-field modelling, Lead-free solders, Microstructure, Deformation, ab initio, calculations
Journal
ACTA MATERIALIA
Volume 188, Issue -, Pages 241-258
Publisher
Elsevier BV
Online
2020-02-05
DOI
10.1016/j.actamat.2020.01.052

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