Machine learning framework for predicting reliability of solder joints
Published 2019 View Full Article
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Title
Machine learning framework for predicting reliability of solder joints
Authors
Keywords
-
Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume ahead-of-print, Issue ahead-of-print, Pages -
Publisher
Emerald
Online
2019-08-13
DOI
10.1108/ssmt-04-2019-0013
References
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Related references
Note: Only part of the references are listed.- Experimental location of damage in microelectronic solder joints after a board level reliability evaluation
- (2018) I-Chih Wu et al. ENGINEERING FAILURE ANALYSIS
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- Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications
- (2017) Hwan-Pil Park et al. JOURNAL OF ELECTRONIC MATERIALS
- Coupling damage and reliability modeling for creep and fatigue of solder joint
- (2017) Yunxia Chen et al. MICROELECTRONICS RELIABILITY
- Thermal cycling effect on the drop reliability of BGA lead-free solder joints
- (2017) Fang Liu et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
- (2015) Jeong-Won Yoon et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications
- (2014) Jussi Putaala et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint
- (2013) Chien-Fu Tseng et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Surface finish effect on reliability of SAC 305 soldered chip resistors
- (2013) Maurice N. Collins et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints
- (2010) S.H. Kim et al. JOURNAL OF MATERIALS RESEARCH
- Constitutive models of creep for lead-free solders
- (2009) Hongtao Ma JOURNAL OF MATERIALS SCIENCE
- Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact
- (2009) Bo Zhang et al. MICROELECTRONICS RELIABILITY
- A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
- (2009) Dominik Herkommer et al. MICROELECTRONICS RELIABILITY
- Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
- (2009) C. Andersson et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Reliability analysis of a novel fan‐out type WLP
- (2009) Ming‐Chih Yew et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
- (2008) Jicheng Gong et al. ACTA MATERIALIA
- Creep damage study at powercycling of lead-free surface mount device
- (2008) Pradeep Hegde et al. COMPUTATIONAL MATERIALS SCIENCE
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