Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies

Published 2016 View Full Article

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Title
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
Authors
Keywords
Creep constitutive relations, Fatigue damage, Constitutive behaviour, Rate-dependent material, Temperature cycling loading, Lead-free solder alloy, Solder joint reliability, Finite element modelling
Journal
JOURNAL OF MANUFACTURING SYSTEMS
Volume 39, Issue -, Pages 9-23
Publisher
Elsevier BV
Online
2016-03-02
DOI
10.1016/j.jmsy.2016.01.002

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