A review of mechanical properties of lead-free solders for electronic packaging

Published 2009 View Full Article

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Title
A review of mechanical properties of lead-free solders for electronic packaging
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE
Volume 44, Issue 5, Pages 1141-1158
Publisher
Springer Nature
Online
2009-01-27
DOI
10.1007/s10853-008-3125-9

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