Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

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Title
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective
Authors
Keywords
Surrogate models, Power electronic module, Sensitivity analysis, Finite element analysis
Journal
MICROELECTRONICS RELIABILITY
Volume 68, Issue -, Pages 77-85
Publisher
Elsevier BV
Online
2016-12-13
DOI
10.1016/j.microrel.2016.12.002

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