Electrostatic Self-Assembled Composite Abrasives for Chemical Mechanical Polishing of A-Plane Sapphire

Focused Ion Beam Milling of Single-Crystal Sapphire with A-, C-, and M-Orientations

(2020) Qiuling Wen et al.   Materials

A novel lapping process for single-crystal sapphire using hybrid nanoparticle suspensions

(2020) Shuiquan Huang et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Novel polyelectrolyte–Al2O3/SiO2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

(2019) Tianxian Wang et al.   JOURNAL OF MATERIALS RESEARCH

Effect of Relative Surface Charge of Colloidal Silica and Sapphire on Removal Rate in Chemical Mechanical Polishing

(2019) Chuljin Park et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Investigation on ultra-precision lapping of A-plane and C-plane sapphires

(2019) Linlin Wan et al.   CERAMICS INTERNATIONAL

Preparation of Irregular Silica Nanoparticles by the Polymer Templating for Chemical Mechanical Polishing of Sapphire Substrates

(2019) Yue Dong et al.   JOURNAL OF ELECTRONIC MATERIALS

Pollution-Free Approaches for Highly Efficient Sapphire Substrate Processing by Mechanical Chemical Polishing

(2019) Yongchao Xu et al.   Catalysts

Preparation of MgO doped colloidal SiO 2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate

(2018) Da Yin et al.   CERAMICS INTERNATIONAL

Research on R-Plane Sapphire Substrate CMP Removal Rate Based on a New-Type Alkaline Slurry

(2018) Xin Zhao et al.   ECS Journal of Solid State Science and Technology

Surface Modified Alumina Particles and Their Chemical Mechanical Polishing (CMP) Behavior on C-plane (0001) Sapphire Substrate

(2017) WANG Wei-Lei et al.   JOURNAL OF INORGANIC MATERIALS

CMP behavior of alumina/metatitanic acid core–shell abrasives on sapphire substrates

(2017) Xin Wang et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Investigation into the anisotropy of cross-grinding surface quality in C- and M-planes of sapphire

(2017) Jinhu Wang et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Effect of a pH Regulator on Sapphire Substrate CMP

(2017) Jianchao Wang et al.   ECS Journal of Solid State Science and Technology

Role of a New Type Chelating Agent in Chemical Mechanical Polishing of R-Plane Sapphire Substrate

(2017) Xin Zhao et al.   ECS Journal of Solid State Science and Technology

Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

(2017) Baichun Zhang et al.   Friction

Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

(2016) Yongchao Xu et al.   APPLIED SURFACE SCIENCE

Synthesis of Zn-doped colloidal SiO2 abrasives and their applications in sapphire chemical mechanical polishing slurry

(2016) Hong Lei et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Preparation of Mg-Doped Colloidal Silica Abrasives and Their Chemical Mechanical Polishing Performances on Sapphire

(2016) Pan Ma et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP)

(2015) Yan Zhou et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing

(2015) Xiaolei Shi et al.   SURFACE & COATINGS TECHNOLOGY

Polymethylmethacrylate (PMMA)/CeO 2 hybrid particles for enhanced chemical mechanical polishing performance

(2015) Yang Chen et al.   TRIBOLOGY INTERNATIONAL

Effect of Polishing Parameters on Chemical Mechanical Planarization of C-Plane (0001) Gallium Nitride Surface Using SiO2and Al2O3Abrasives

(2014) Khushnuma Asghar et al.   ECS Journal of Solid State Science and Technology

Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping

(2013) Xiaohai Zhu et al.   WEAR

Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials

(2012) Hideo Aida et al.   CURRENT APPLIED PHYSICS

Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer

(2012) Hyunseop Lee et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Mechanism of the interaction between Al2O3 and SiO2 during the chemical-mechanical polishing of sapphire with silicon dioxide

(2012) E. A. Vovk et al.   Journal of Surface Investigation-X-Ray Synchrotron and Neutron Techniques

A Study of the Colloidal Stability of Mixed Abrasive Slurries and Their Role in CMP

(2012) F. Lin et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Machining processes for sapphire wafers: a literature review

(2011) Z C Li et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE