Effect of Relative Surface Charge of Colloidal Silica and Sapphire on Removal Rate in Chemical Mechanical Polishing

Preparation of Ce-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates

(2016) Hong Lei et al.   MATERIALS CHEMISTRY AND PHYSICS

Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic

(2016) Youngkyun Lee et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Effect of glycine on copper CMP

(2016) Soocheon Jang et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire

(2015) Li Xu et al.   APPLIED SURFACE SCIENCE

The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

(2015) Dasol Lee et al.   Journal of Mechanical Science and Technology

Development of green CMP by slurry reduction through controlling platen coolant temperature

(2015) Minjong Yuh et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Effect of surfactant on package substrate in chemical mechanical planarization

(2015) Soocheon Jang et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Signal analysis of CMP process based on AE monitoring system

(2015) Sun-Joon Park et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

(2015) Chuljin Park et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

(2014) Hyunseop Lee et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer

(2012) Hyunseop Lee et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Adsorption of non-ionic surfactants to the sapphire/solution interface – Effects of temperature and pH

(2011) Ningning Li et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE

Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing

(2011) Zefang Zhang et al.   MICROELECTRONIC ENGINEERING