Pollution-Free Approaches for Highly Efficient Sapphire Substrate Processing by Mechanical Chemical Polishing

AFM characterization of patterned sapphire substrate with dense cone arrays: Image artifacts and tip-cone convolution effect

(2018) Jian Shen et al.   APPLIED SURFACE SCIENCE

Removal mechanism of 4H- and 6H-SiC substrates (0001 and 0001¯) in mechanical planarization machining

(2017) Jing Lu et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Environmental impact of concentration of slurry components in thick copper CMP

(2017) Hyunseop Lee   International Journal of Precision Engineering and Manufacturing-Green Technology

Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

(2016) Yongchao Xu et al.   APPLIED SURFACE SCIENCE

Modeling the dependency of edge chipping size on the material properties and cutting force for rotary ultrasonic drilling of brittle materials

(2016) Jianjian Wang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Luminescence and coloration of undoped and Ti-doped sapphire crystals grown by Czochralski technique

(2016) G. Alombert-Goget et al.   JOURNAL OF LUMINESCENCE

Preparation of La-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates

(2016) Hong Lei et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Effect of glycine on copper CMP

(2016) Soocheon Jang et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Effect of platen shape on evolution of total thickness variation in single-sided lapping of sapphire wafer

(2016) Taekyung Lee et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire

(2015) Li Xu et al.   APPLIED SURFACE SCIENCE

The Research of Reactivity between Nano-abrasives and Sapphire during Polishing Process

(2015) Yongchao Xu et al.   INTEGRATED FERROELECTRICS

A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing

(2015) Xiaolei Shi et al.   SURFACE & COATINGS TECHNOLOGY

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

(2015) Yan Zhou et al.   TRIBOLOGY INTERNATIONAL

The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

(2015) Chuljin Park et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

(2015) Doyeon Kim et al.   International Journal of Precision Engineering and Manufacturing-Green Technology

Mechanism of the interaction between Al2O3 and SiO2 during the chemical-mechanical polishing of sapphire with silicon dioxide

(2012) E. A. Vovk et al.   Journal of Surface Investigation-X-Ray Synchrotron and Neutron Techniques