Material Removal Rate Prediction for Sapphire Double-Sided CMP Based on RSM-SVM
Published 2022 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Material Removal Rate Prediction for Sapphire Double-Sided CMP Based on RSM-SVM
Authors
Keywords
-
Journal
ECS Journal of Solid State Science and Technology
Volume 11, Issue 8, Pages 084002
Publisher
The Electrochemical Society
Online
2022-07-23
DOI
10.1149/2162-8777/ac8371
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Experimental and theoretical analysis of single-sided and double-sided chemical mechanical polishing of sapphire wafers
- (2022) Zhongyang Li et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Analytical Modelling of Material Removal in Copper Chemical Mechanical Polishing Incorporating the Scratch Hardness of the Passivated Layer on Copper Thin Film Wafer
- (2022) Mohit Sharma et al. ECS Journal of Solid State Science and Technology
- Prediction research for surface topography of internal grinding based on mechanism and data model
- (2021) Qianwei Gu et al. The International Journal of Advanced Manufacturing Technology
- Chemical mechanical polishing for sapphire wafers using a developed slurry
- (2021) Zhenyu Zhang et al. Journal of Manufacturing Processes
- Novel monitoring method for material removal rate considering quantitative wear of abrasive belts based on LightGBM learning algorithm
- (2021) Nina Wang et al. The International Journal of Advanced Manufacturing Technology
- A Neural Network-Based Approach to Material Removal Rate Prediction for Copper Chemical Mechanical Planarization
- (2021) Qinzhi Xu et al. ECS Journal of Solid State Science and Technology
- Chemical-mechanical polishing performance of core-shell structured polystyrene@ceria/nanodiamond ternary abrasives on sapphire wafer
- (2021) Chen Zhou et al. CERAMICS INTERNATIONAL
- Predicting load capacity of shear walls using SVR–RSM model
- (2021) Behrooz Keshtegar et al. APPLIED SOFT COMPUTING
- Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process
- (2021) Song Yuan et al. APPLIED SURFACE SCIENCE
- A study on mechanism of sapphire polishing using the diamond abrasive by molecular dynamics
- (2021) Chong Sheng et al. MECHANICS OF ADVANCED MATERIALS AND STRUCTURES
- Effects of ultrasonic amplitude on sapphire ultrasonic vibration assisted chemical mechanical polishing by experimental and CFD method
- (2021) Mufang Zhou et al. MECHANICS OF ADVANCED MATERIALS AND STRUCTURES
- A new method for polishing the inner wall of a circular tube with a soft abrasive rotating jet
- (2021) Jun Zhao et al. POWDER TECHNOLOGY
- Prediction of the surface roughness and material removal rate in chemical mechanical polishing of single-crystal SiC via a back-propagation neural network
- (2021) Jiayun Deng et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Material removal predictions in the robot glass polishing process using machine learning
- (2021) Max Schneckenburger et al. SN Applied Sciences
- Quadrature moment simulation of silica nanoparticles aggregation and breakage in chemical mechanical polishing
- (2021) Seulgi Choi et al. JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
- Effects of polishing parameters on surface quality in sapphire double-sided CMP
- (2020) Zhongyang Li et al. CERAMICS INTERNATIONAL
- An efficient material removal rate prediction model for cemented carbide inserts chemical mechanical polishing
- (2020) Changjiang Qin et al. WEAR
- Abrasive mechanisms and interfacial mechanics of amorphous silicon carbide thin films in chemical-mechanical planarization
- (2020) Van-Thuc Nguyen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Prediction of material removal rate in chemical mechanical polishing via residual convolutional neural network
- (2020) Jiusi Zhang et al. CONTROL ENGINEERING PRACTICE
- Effects of pressure and velocity on the interface friction behavior of diamond utilizing ReaxFF simulations
- (2020) Song Yuan et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- A novel material removal prediction method based on acoustic sensing and ensemble XGBoost learning algorithm for robotic belt grinding of Inconel 718
- (2019) Kaiyuan Gao et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Optimal parameter ranges of material removal depth of abrasive cloth wheel polishing based on sensitivity analysis
- (2019) Xiaojun Lin et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing
- (2019) Lin Wang et al. TRIBOLOGY INTERNATIONAL
- Prediction of surface roughness and material removal rate in wire electrical discharge machining on aluminum based alloys/composites using Taguchi coupled Grey Relational Analysis and Artificial Neural Networks
- (2018) Titus Thankachan et al. APPLIED SURFACE SCIENCE
- Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP
- (2018) Yongchao Xu et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field
- (2018) Xiaoguang Guo et al. COMPUTATIONAL MATERIALS SCIENCE
- Chemical–mechanical wear of monocrystalline silicon by a single pad asperity
- (2017) Lin Wang et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Optimization of abrasive flow polishing process parameters for static blade ring based on response surface methodology
- (2016) Zhao Tao et al. Journal of Mechanical Science and Technology
- Preparation of La-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates
- (2016) Hong Lei et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
- (2014) N. Y. Nguyen et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
- (2013) Dewen Zhao et al. MICROELECTRONIC ENGINEERING
- Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
- (2013) H.S. Lee et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
- (2012) Jing Li et al. APPLIED SURFACE SCIENCE
- Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing
- (2011) Xiaoyan Liu et al. MICROELECTRONIC ENGINEERING
- Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model
- (2011) Xiaoyan Liu et al. THIN SOLID FILMS
- CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect
- (2010) Hong Shi et al. MICROELECTRONIC ENGINEERING
- A study on the characteristic of parameters by the response surface method in final wafer polishing
- (2009) Eun-Sang Lee et al. International Journal of Precision Engineering and Manufacturing
Add your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload NowAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started