A study on mechanism of sapphire polishing using the diamond abrasive by molecular dynamics

Deformation anisotropy of nano-scratching on C-plane of sapphire: A molecular dynamics study and experiment

(2021) Jiaming Lin et al.   APPLIED SURFACE SCIENCE

Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

(2020) Van-Thuc Nguyen et al.   CERAMICS INTERNATIONAL

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

(2020) Tengda Ma et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Effects of Anisotropy on Single Crystal Silicon in Polishing Non-Continuous Surface

(2020) Guilian Wang et al.   Micromachines

Study on ultra-high speed nano-grinding of monocrystalline copper with V-shaped diamond abrasive grains based on molecular dynamics method

(2020) Longzhou Dai et al.   DIAMOND AND RELATED MATERIALS

Investigation of vibration-assisted nano-grinding of gallium nitride via molecular dynamics

(2020) Yuhua Huang et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groups

(2020) Xiaoqin Sun et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Molecular dynamics simulation of nanoindentation on c-plane sapphire

(2020) Jiaming Lin et al.   MECHANICS OF MATERIALS

Surface removal of a copper thin film in an ultrathin water environment by a molecular dynamics study

(2019) Junqin Shi et al.   Friction

Investigation on ultra-precision lapping of A-plane and C-plane sapphires

(2019) Linlin Wan et al.   CERAMICS INTERNATIONAL

Research on ground surface characteristics of prism-plane sapphire under the orthogonal grinding direction

(2019) Wenxiang Zhao et al.   APPLIED SURFACE SCIENCE

Simulation and experimental study on the effect of abrasive size, rotational speed, and machining gap during ultra-precision polishing of monocrystalline silicon

(2019) Mohammad Mosavat et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Nanoscale indentation and scratching tests of single crystal sapphire using molecular dynamics simulation

(2019) Woo Kyun Kim et al.   COMPUTATIONAL MATERIALS SCIENCE

Atomistic simulation of influence of laser nano-structured diamond abrasive on the polishing behavior of silicon

(2019) Houfu Dai et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

(2018) Junqin Shi et al.   APPLIED SURFACE SCIENCE

A molecular dynamics study on atomistic mechanisms of nano-scale cutting process of sapphire

(2017) Woo Kyun Kim et al.   Journal of Mechanical Science and Technology

Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

(2016) Yongchao Xu et al.   APPLIED SURFACE SCIENCE

Effect of surfactant and electrolyte on surface modification of c-plane GaN substrate using chemical mechanical planarization (CMP) process

(2016) Khushnuma Asghar et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

An investigation into the influence of grain boundary misorientation on the tensile strength of SiC bicrystals

(2015) You Sung Han et al.   MECHANICS OF ADVANCED MATERIALS AND STRUCTURES

Role of ionic strength in chemical mechanical polishing of silicon carbide using silica slurries

(2014) Uma Rames Krishna Lagudu et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Compressive behavior of CNT-reinforced aluminum composites using molecular dynamics

(2013) Nuno Silvestre et al.   COMPOSITES SCIENCE AND TECHNOLOGY

Experimental study on brittle–ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain

(2013) Zhiqiang Liang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials

(2012) Hideo Aida et al.   CURRENT APPLIED PHYSICS

Analysis of interacting cracks due to sequential indentations on sapphire

(2011) Edward J. Haney et al.   ACTA MATERIALIA

Static and dynamic indentation response of basal and prism plane sapphire

(2011) Edward J. Haney et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing

(2011) Zefang Zhang et al.   MICROELECTRONIC ENGINEERING

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

(2010) Wenhu Xu et al.   APPLIED SURFACE SCIENCE

Extracting dislocations and non-dislocation crystal defects from atomistic simulation data

(2010) Alexander Stukowski et al.   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool

(2009) Alexander Stukowski   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Study of Materials Deformation in Nanometric Cutting by Large-scale Molecular Dynamics Simulations

(2009) Q. X. Pei et al.   Nanoscale Research Letters

Molecular dynamics simulation of subsurface deformed layers in AFM-based nanometric cutting process

(2008) J.J. Zhang et al.   APPLIED SURFACE SCIENCE

The influence of different cutting speeds on the cutting force and strain–stress behaviors of single crystal copper during nano-scale orthogonal cutting

(2007) Zone-Ching Lin et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY