Chemical mechanical polishing for sapphire wafers using a developed slurry
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Title
Chemical mechanical polishing for sapphire wafers using a developed slurry
Authors
Keywords
Sapphire, CMP, XPS, IR, Green
Journal
Journal of Manufacturing Processes
Volume 62, Issue -, Pages 762-771
Publisher
Elsevier BV
Online
2021-01-18
DOI
10.1016/j.jmapro.2021.01.004
References
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Related references
Note: Only part of the references are listed.- Effects of polishing parameters on surface quality in sapphire double-sided CMP
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