Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

Published 2018 View Full Article

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Title
Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP
Authors
Keywords
Sapphire, SG polishing, Gas-liquid assisted chemical mechanical polishing, Material removal rate, Sub-surface damage
Journal
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
Volume 130-131, Issue -, Pages 12-19
Publisher
Elsevier BV
Online
2018-03-13
DOI
10.1016/j.ijmachtools.2018.03.002

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