Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing

Published 2011 View Full Article

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Title
Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 91, Issue -, Pages 19-23
Publisher
Elsevier BV
Online
2011-11-09
DOI
10.1016/j.mee.2011.10.011

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