Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process

Published 2013 View Full Article

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Title
Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 108, Issue -, Pages 33-38
Publisher
Elsevier BV
Online
2013-03-20
DOI
10.1016/j.mee.2013.03.042

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