Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model

Published 2011 View Full Article

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Title
Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 520, Issue 1, Pages 400-403
Publisher
Elsevier BV
Online
2011-07-01
DOI
10.1016/j.tsf.2011.06.050

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