CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect

Published 2010 View Full Article

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Title
CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 87, Issue 11, Pages 2368-2375
Publisher
Elsevier BV
Online
2010-04-14
DOI
10.1016/j.mee.2010.04.010

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