A review on laser drilling and cutting of silicon

Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

(2020) Hongshuang Li et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Laser ablation of silicon in water at different temperatures

(2020) Wisan Charee et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

One-Step Femtosecond Laser Stealth Dicing of Quartz

(2020) Caterina Gaudiuso et al.   Micromachines

Pulse-duration dependence of laser-induced modifications inside silicon

(2020) AMLAN DAS et al.   OPTICS EXPRESS

Sub-Picosecond Micromachining of Monocrystalline Silicon for Solar Cell Manufacturing

(2020) Katarzyna Garasz et al.   Applied Sciences-Basel

Stealth dicing of sapphire sheets with low surface roughness, zero kerf width, debris/crack-free and zero taper using a femtosecond Bessel beam

(2020) Zhaoqing Li et al.   OPTICS AND LASER TECHNOLOGY

Characterization and control of laser induced modification inside silicon

(2019) Xinya Wang et al.   JOURNAL OF LASER APPLICATIONS

The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation

(2019) Xiaoliang Cheng et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Numerical study on thermal stress cutting of silicon wafers using two-line laser beams

(2019) Sungho Choi et al.   Journal of Mechanical Science and Technology

PICOSECOND LASER MICROMACHINING OF SILICON WAFER: CHARACTERIZATIONS AND ELECTRICAL PROPERTIES

(2019) FANG ZHIHAO et al.   SURFACE REVIEW AND LETTERS

Temperature field modeling and cut formation in laser micromachining of silicon in ice layer

(2019) Viboon Tangwarodomnukun et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Studies on laser ablation of silicon using near IR picosecond and deep UV nanosecond lasers

(2019) M.E. Shaheen et al.   OPTICS AND LASERS IN ENGINEERING

Laser ablation mechanism of silicon nitride with nanosecond and picosecond lasers

(2019) B. Soltani et al.   OPTICS AND LASER TECHNOLOGY

Target properties – Plasma dynamics relationship in laser ablation of metals: Common trends for fs, ps and ns irradiation regimes

(2019) Stefan Andrei Irimiciuc et al.   APPLIED SURFACE SCIENCE

Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw

(2019) Youkang Yin et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Effect of scanning pitch on nanosecond laser micro-drilling of silicon nitride ceramic

(2018) Hong-Jian Wang et al.   CERAMICS INTERNATIONAL

Characterization of hole taper in laser drilling of silicon nitride ceramic under water

(2018) Qiang Chen et al.   CERAMICS INTERNATIONAL

A hybrid method of ultrafast laser dicing and high density plasma etching with water soluble mask for thin silicon wafer cutting

(2018) Shih-jeh Wu   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Experimental analysis of Nd-YAG laser cutting of sheet materials – A review

(2018) Amit Sharma et al.   OPTICS AND LASER TECHNOLOGY

Controllable laser thermal cleavage of sapphire wafers

(2018) Jiayu Xu et al.   OPTICS AND LASERS IN ENGINEERING

A novel technique for slicing SiC ingots by EDM utilizing a running ultra-thin foil tool electrode

(2018) Yonghua Zhao et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Femtosecond laser ablation of dielectric layers for high-efficiency silicon wafer solar cells

(2018) Jaffar Moideen Yacob Ali et al.   SOLAR ENERGY

Rational design of silicon structures for optically controlled multiscale biointerfaces

(2018) Yuanwen Jiang et al.   Nature Biomedical Engineering

Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip

(2018) Amir H. Atabaki et al.   NATURE

Microcrystalline silicon thin film deposition from silicon tetrafluoride: Isolating role of ion energy using tailored voltage waveform plasmas

(2018) Junkang Wang et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Effect of fs/ps laser pulsewidth on ablation of metals and silicon in air and liquids, and on their nanoparticle yields

(2018) I.N. Saraeva et al.   APPLIED SURFACE SCIENCE

Analysis of nanosecond and femtosecond laser ablation of rear dielectrics of silicon wafer solar cells

(2018) Jaffar Moideen Yacob Ali et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Wavelength scaling of silicon laser ablation in picosecond regime

(2017) A. Sikora et al.   JOURNAL OF APPLIED PHYSICS

Nanosecond-laser patterning of 3Y-TZP: Damage and microstructural changes

(2017) E. Roitero et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Laser drilling of structural ceramics—A review

(2017) Hongjian Wang et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

(2017) Yecheng Cai et al.   OPTICS AND LASER TECHNOLOGY

Silicon crystallinity control during laser direct microstructuring with bursts of picosecond pulses

(2017) Jaka Mur et al.   OPTICS EXPRESS

Enhancement of surface area and wettability properties of boron doped diamond by femtosecond laser-induced periodic surface structuring

(2017) Eduardo Granados et al.   Optical Materials Express

Threshold for permanent refractive index change in crystalline silicon by femtosecond laser irradiation

(2016) D. Bachman et al.   APPLIED PHYSICS LETTERS

Liquid-assisted laser ablation of advanced ceramics and glass-ceramic materials

(2016) A. Garcia-Giron et al.   APPLIED SURFACE SCIENCE

A study on co-axial water-jet assisted fiber laser grooving of silicon

(2016) Yuvraj K. Madhukar et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength

(2016) Matthias Domke et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Industrial applications of ultrafast laser processing

(2016) Eric Mottay et al.   MRS BULLETIN

Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation

(2016) Yecheng Cai et al.   OPTICS AND LASERS IN ENGINEERING

Beam delivery system with a non-digitized diffractive beam splitter for laser-drilling of silicon

(2016) J. Amako et al.   OPTICS AND LASERS IN ENGINEERING

Laser ablation of titanium nitride coated on silicon wafer substrate for depth profiling using ICP-MS

(2015) Jin Sook Lee et al.   APPLIED SURFACE SCIENCE

Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

(2015) Weng Hong Teh et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Comparison of bending fracture strength of silicon after ablation with nanosecond and picosecond lasers

(2015) Jiwhan Noh et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Dicing of Thin Silicon Wafers with Ultra-Short Pulsed Lasers in the Range from 200 fs up to 10 ps

(2015) C. Fornaroli   Journal of Laser Micro Nanoengineering

Optimization of plasma effect in laser drilling of high aspect ratio microvias

(2015) V N Tokarev et al.   LASER PHYSICS

Theoretical study of pre-formed hole geometries on femtosecond pulse energy distribution in laser drilling

(2015) L. S. Jiao et al.   OPTICS EXPRESS

Multi-discharge EDM coring of single crystal SiC ingot by electrostatic induction feeding method

(2015) Yonghua Zhao et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Laser Micromachining of Glass, Silicon, and Ceramics

(2015) L. Rihakova et al.   Advances in Materials Science and Engineering

Ultrafast laser processing of materials: a review

(2015) Katherine C. Phillips et al.   Advances in Optics and Photonics

Influence of substrate heating on hole geometry and spatter area in femtosecond laser drilling of silicon

(2014) L. S. Jiao et al.   APPLIED PHYSICS LETTERS

Laser ablation of silicon in water under different flow rates

(2014) Wisan Charee et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Low-cost silicon wafer dicing using a craft cutter

(2014) Yiqiang Fan et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Detection of buried layers in silicon devices using LIBS during hole drilling with femtosecond laser pulses

(2013) S. P. Banerjee et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Influence of ambient pressure on the hole formation in laser deep drilling

(2013) S. Döring et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Femtosecond versus picosecond laser machining of nano-gratings and micro-channels in silica glass

(2013) Costantino Corbari et al.   OPTICS EXPRESS

Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication

(2012) Sanghoon Ahn et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Microhole machining of silicon wafer in air and under deionized water by pulsed UV laser system

(2012) Wen-Tse Hsiao et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Infrared long nanosecond laser pulse ablation of silicon: Integrated two-dimensional modeling and time-resolved experimental study

(2012) Sha Tao et al.   APPLIED SURFACE SCIENCE

A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries

(2012) Muhammad Arif et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

An investigation of hybrid laser–waterjet ablation of silicon substrates

(2012) V. Tangwarodomnukun et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process

(2012) Chao-Wei Tang et al.   Micro & Nano Letters

Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy

(2012) Chao-Wei Tang et al.   MICROELECTRONICS RELIABILITY

Light extraction efficiency improvement by multiple laser stealth dicing in InGaN-based blue light-emitting diodes

(2012) Yiyun Zhang et al.   OPTICS EXPRESS

Role of volatile liquids in debris and hole taper angle reduction during femtosecond laser drilling of silicon

(2011) L. S. Jiao et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Water Jet Guided Laser Cutting of Silicon Thin Films Using 515nm Disk Laser

(2011) Eva-Maria Heilmann   Journal of Laser Micro Nanoengineering

STATISTICAL ANALYSIS OF FEMTOSECOND PULSES LASER ON HOLE DRILLING OF SILICON WAFER

(2011) L. JIAO et al.   SURFACE REVIEW AND LETTERS

Laser cutting of silicon with the liquid jet guided laser using a chlorine-containing jet media

(2010) Sybille Hopman et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064nm through time-resolved observation

(2010) Yun Zhou et al.   APPLIED SURFACE SCIENCE

Analysis of silicon via hole drilling for wafer level chip stacking by UV laser

(2010) Young-Hyun Lee et al.   International Journal of Precision Engineering and Manufacturing

Laser Dicing of Silicon:Comparison of Ablation Mechanisms with a Novel Technology of Thermally Induced Stress

(2010) Oliver Haupt   Journal of Laser Micro Nanoengineering

Micro-machining of silicon wafer in air and under water

(2010) L.M. Wee et al.   OPTICS AND LASER TECHNOLOGY

Very large spot size effect in nanosecond laser drilling efficiency of silicon

(2010) Fernando Brandi et al.   OPTICS EXPRESS

Theoretical approach to estimate laser process parameters for drilling in crystalline silicon

(2010) T. Baier et al.   PROGRESS IN PHOTOVOLTAICS

Comparison of Laser Chemical Processing and LaserMicroJet for structuring and cutting silicon substrates

(2009) Sybille Hopman et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

UV excimer laser drilled high aspect ratio submicron via hole

(2009) K.H. Chen et al.   APPLIED SURFACE SCIENCE

Experimental study of infrared nanosecond laser ablation of silicon: The multi-pulse enhancement effect

(2009) Ziyi Fu et al.   APPLIED SURFACE SCIENCE

Thermal modeling and experimental study of infrared nanosecond laser ablation of silicon

(2009) Sha Tao et al.   JOURNAL OF APPLIED PHYSICS

Potential and limits of chemical enhanced deep cutting of silicon with a coupled laser-liquid jet

(2009) A. Fell et al.   JOURNAL OF LASER APPLICATIONS

Laser machining of structural ceramics—A review

(2009) Anoop N. Samant et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Laser singulation of thin wafer: Die strength and surface roughness analysis of 80μm silicon dice

(2009) Nitin Sudani et al.   OPTICS AND LASERS IN ENGINEERING

High repetition rate femtosecond laser nano-machining of thin films

(2008) B. Tan et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer

(2008) Etsuji OHMURA et al.   Journal of Advanced Mechanical Design Systems and Manufacturing

Insight into electronic mechanisms of nanosecond-laser ablation of silicon

(2008) Wladimir Marine et al.   JOURNAL OF APPLIED PHYSICS